We bring better performance to FTTx, CATV, HDTV, and FTTx communication systems; semiconductor and microprocessor production; and more.

Electronics & Thermal Solutions
- Intel® reference design heat sinks
- Ultra-thin Peraflex® heat pipes
- UV backgrind and dicing tape
- Tex-E Wire

FITEL® Fiber Optic Communications Devices
- Fusion splicers
- 980nm, 1480nm and 14xx nm pump laser diodes
- EDFA, Raman and double-clad amplifiers
- MT ferrules and MPO connectors
- SMPTE 311M optical cable
 

Furukawa UV Tape
at SEMICON WEST 2008
July 15-17
San Francisco, CA
Moscone Center
Booth 7756



June 28, 2008 – See Furukawa’s latest UV Tape offerings at SEMICON West 2008 at the Moscone Center in San Francisco, CA, July 15-17.

SEMICON West 2008 is the industry’s leading annual conference showcasing the latest in technology and products for microelectronics manufacturing.

Furukawas offers a full line of high quality UV tape for back-grinding, etching, dicing and BGA/CSP package dicing – all designed to improve semiconductor chip reliability while reducing wafer waste.

Come see how in Furukawa’s booth 7756 at SEMICON West 2008.

Furukawa America Inc.
SEMICON West 2008
Booth 7756
July 15-17, 2008
Moscone Center
San Francisco, CA
 
more
 
 
 
Communications
Fusion Splicers
Splicing Tools & Accessories
Optical Connectors
Pump Lasers
Signal Lasers
Passive Components
Blue Laser
Optical Amplifiers
Photodiodes
Electronics
Thermal Solutions
Polyimide Tubing
UV Backgrind & Dicing Tape
Memory Disks
Triple Insulated Wire
Specialty
NT Alloys
Copper Products
HDTV Optical Cable
MCPET Reflective Light Sheets
FEMCO Magnet Wire
 
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